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 PD - 90639A
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET TRANSISTORS THRU-HOLE (TO-39)
Product Summary
Part Number BVDSS RDS(on) IRLF120 100V 0.35 ID 5.3A
IRLF120
100V, N-CHANNEL
The Logic Level `L' series of power MOSFETs are designed to be operated with level logic gate-to-source voltage of 5V. In addition to the well established characterstics of HEXFETs , they have the added advantage of providing low drive requirements to interface power loads to logic level IC's and microprocessors. Fields of applications include: high speed power applications such as switching regulators, switching converters, motor drivers, solenoid and relay drivers and drivers for high power bipolar switching transistors requiring high speed and low gatedrive voltage. The HEXFET technology is the key to International Rectifier's advanced line of logic level power MOSFET transistors. The efficient geometry and unique processing of the HEXFET achieve very low on-state resistance combined with high transconductance and great device ruggedness. .
TO-39
Features:
n n n n n n n n
Repetitive Avalanche Ratings Dynamic dv/dt Rating Low Drive Requirements Execellent Temperature Stability Fast Switching Speeds Ease of Paralleling Hermetically Sealed Light Weight
Absolute Maximum Ratings
ID @ VGS = 5.0V, TC = 25C ID @ VGS = 5.0V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG
Parameter
Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight For footnotes refer to the last page 5.3 3.4 21 20 0.16 10 120 5.3 2.0 5.5 -55 to 150 300 (0.063 in. (1.6mm) from case for 10s) 0.98(typical)
Units A
W
W/C
V mJ A mJ V/ns
o
C
g
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08/08/01
IRLF120
Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage BV DSS/T J Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current
Min
100 -- -- -- 1.0 3.1 -- -- -- -- -- -- -- -- -- -- -- --
Typ Max Units
-- 0.13 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 7.0 -- -- 0.35 0.42 2.0 -- 250 1000 100 -100 13 2.4 7.1 13 53 30 27 -- V V/C V S( ) A
Test Conditions
VGS = 0V, ID = 250A Reference to 25C, ID = 250A VGS = 5.0V, ID = 3.2A VGS = 4.0V, ID = 2.7A VDS = VGS, ID = 250A VDS = 50V, IDS = 3.2A VDS= 100V, VGS=0V VDS = 80V VGS = 0V, TJ = 125C VGS = 10V VGS = -10V VGS =5.0V, ID = 5.3A VDS= 80V VDD = 50V, ID = 5.3A, VGS =5.0V, RG = 18
IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance
nA nC
ns
nH
Measured from drain lead (6mm/ 0.25in. from package) to source lead (6mm/0.25in. from package)
Ciss C oss C rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
480 150 30
-- --
pF
VGS = 0V, VDS = 25V f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- 5.3 21 2.5 220 1.1
Test Conditions
A
V nS C Tj = 25C, IS = 5.3A, VGS = 0V Tj = 25C, IF = 5.3A, di/dt 100A/s VDD 50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC RthJA Junction-to-Case Junction-to-Ambient
Min Typ Max Units
-- -- -- -- 6.25 175
C/W
Test Conditions
Typical socket mount.
Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page
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IRLF120
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs.Temperature
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IRLF120
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
4
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IRLF120
V DS VGS RG
RD
D.U.T.
+
-V DD
VGS
Pulse Width 1 s Duty Factor 0.1 %
Fig 10a. Switching Time Test Circuit
VDS 90%
Fig 9. Maximum Drain Current Vs. CaseTemperature
10% VGS
td(on) tr t d(off) tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRLF120
1 5V
VD S
L
D R IV E R
RG
D .U .T
IA S
+ - VD D
A
VGS 20V
tp
0 .0 1
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D S S tp
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
50K
QG
12V
.2F .3F
5.0 V
QGS VG QGD
VGS
3mA
D.U.T.
+ V - DS
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
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IRLF120
Foot Notes:
Repetitive Rating; Pulse width limited by
maximum junction temperature. VDD = 25 V, Starting TJ = 25C, L= 6.1mH Peak IAS = 5.3A, VGS =5.0V, RG= 25 VDD 100V, TJ 150C Suggested RG =18 Pulse width 300 s; Duty Cycle 2%
ISD 5.3A, di/dt 110A/s,
Case Outline and Dimensions --TO-205AF ( TO-39)
LEGEND 1- SOURCE 2- GATE 3- DRAIN
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 08/01
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